| 摘要 |
PURPOSE:For increasing electrodes for take-out in quantity without changing the a semiconductor substrate in size, to arrange a plurality of lines of a plurality of the electrodes formed on a chip at the periphery thereof and to give different heights to said electrodes. CONSTITUTION:Two inner and outer lines of electrodes 2' and 2 are formed when the electrodes are formed of Au at the periphery of a semiconductor chip 1. Further, said outer electrodes 2 are made smaller in height than said inner electrodes 2'. Said chip 1 is fastened on the package 3 fitted with a package electrode 4, and said electrodes 2 and 2' are connected to said electrode 4 by using very thin Al wires 5. Thereby, a number of electrodes can be easily made avoiding the mutual contact of said Al wires 5. The increase in quantity of electrodes can be attained by that of the lines thereof. |
