| 摘要 |
PROBLEM TO BE SOLVED: To make an electrode constituting a wiring pattern hardly scraped, when flattening an insulation layer surface by CMP method.SOLUTION: A method of manufacturing an electronic device has a step of forming a first electrode on a substrate, a step of forming a first insulation layer on the first electrode, a step of forming a second electrode on the first insulation layer, a step of forming a second insulation layer on the second electrode, and a step of polishing the surface of the second insulation layer by CMP method. The end of the second electrode closest to the outer periphery of the substrate is formed at a position, closer to the outer periphery of the substrate, than the end of the first electrode closest to the outer periphery of the substrate.SELECTED DRAWING: Figure 1 |
