| 摘要 |
PURPOSE:To minimize deformation of an inner lead, which occurs during processing of a lead frame, by forming the inner lead after plating of the lead frame. CONSTITUTION:A lead frame is equipped with a loading section 1 for attaching a semiconductor element, an inner lead 2, an outer lead 3, an outer lead supporting frame 4 and a frame 5. When manufacturing this lead frame, plating work is conducted in the condition that the supporting frame 6 is provided in the neighborhood of the center of the lead 3 like the supporting frame 4, or in the case of manufacturing the lead frame by a press which removes unnecessary portions gradually, the plating work is done immediately before cutting the lead 3 off. And then, by blanking out the supporting frame or the unnecessary portion and separating the leads 3 from one another, a required lead frame is obtained. When this process is used, the lead 3 in plating is provided with the supporting frame, it can be prevented from deforming. |
