Electronic circuit packages

摘要

An electronic circuit comprising a circuit substrate with electronic circuit elements bonded onto the circuit substrate with gaps between the circuit substrate and the respective electronic circuit elements has thermal conductive layers comprising an oxidatively curable resin filled into the gaps. The thermal conductive layers are produced by filling a varnish comprising an oxidatively curable resin into the gaps and exhibit excellent moist heat resistance and thermal conductive properties. The electronic circuit elements once mounted on the circuit substrate can easily be removed as required by releasing the bonding between the elements and the substrate.