发明名称 PACKAGING MATERIAL, AND PACKAGE PREPARED THEREWITH
摘要 PROBLEM TO BE SOLVED: To provide a packaging material that improves the self-standing properties of a plastic film, has proper strength for the protection of contents, and also has excellent heat sealability and impact resistance, and a package.SOLUTION: A packaging material has a substrate layer, and at least a heat adhesive resin layer above the substrate layer. In the heat adhesive resin layer, a first resin layer and a second resin layer are in close contact with each other for lamination, a boundary between the first resin layer and the second resin layer is formed in an uneven shape, and the second resin layer has a concave shape/convex shape corresponding to a convex shape/concave shape formed in the first resin layer.SELECTED DRAWING: Figure 1
申请公布号 JP2016172572(A) 申请公布日期 2016.09.29
申请号 JP20150053085 申请日期 2015.03.17
申请人 TOPPAN PRINTING CO LTD 发明人 KIMURA KAZUTERU
分类号 B65D65/40;B32B3/26;B32B27/00;B65D75/52 主分类号 B65D65/40
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