| 摘要 |
An LED lamp (1) comprises a light source board (10), a plurality of LED dies (20) and a plurality of heat sinks (30) mounted on the light source board (10). Each two LED dies (20) corresponds to one or more heat sinks (30), and thermal conduction occurs between each of the LED dies (20) and the heat sink (30) corresponding thereto. By dispersing and distributing the heat sinks (30) to each of the LED dies (20), and not employing a large integrated member, the inner space of the LED lamp (1) can be simply and flexibly configured, eliminating the need to reserve a large space for the heat sink (30), thus effectively reducing a size of the LED lamp (1), and enabling flexible design of an overall shape of the LED lamp (1). |
