发明名称 Floor topping for buildings and process for its manufacture
摘要 A floor topping for buildings and a process for its manufacture using a hollow-panel structure, the hollow panels (1) being arranged in parallel next to one another and at a distance from one another, for example a distance which corresponds to the width of the hollow panel itself or a multiple thereof. Part of the cavity, located between in each case two parallel hollow panels (1), of the floor topping is formed so as to be structurally lighter than the hollow-panel structure, such as, for example, a structure (6) of concrete tiles, of wood, or of profiled sheet metal. The uniform structure (6) of concrete tiles, of wood or of profiled sheet metal, is arranged at a distance above the hollow panels (1), an essentially non-compliant, rigid heat insulation (5) being arranged between the upper side of the hollow panels (1) and the underside of the structure of concrete tiles, of wood, or of profiled sheet metal. In the case of the cavities located between the hollow panels (1), an elastic, compliant heat insulation (4) is preferably used on the underside of the structure (6) of concrete tiles, of wood, or of profiled sheet metal. <IMAGE>
申请公布号 DE3334027(A1) 申请公布日期 1984.04.12
申请号 DE19833334027 申请日期 1983.09.21
申请人 OSAKEYHTIOE PARTEK AB, 00500 HELSINKI, FI 发明人 RASINAHO, ISMO, 40500 JYVAESKYLAE, FI
分类号 E04B1/76;E04B5/02;(IPC1-7):04B5/02;04B1/78 主分类号 E04B1/76
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