| 摘要 |
A layer of dielectric material, carrying printed or thick-film circuit components on opposite surfaces, is provided with one or more bores extending between aligned circuit points to be conductively interconnected. The layer is sandwiched between two masks having a perforation of larger diameter in line with each bore, such perforation communicating with a respective chamber in an adjoining member forming part of a pair of clamp jaws pressing the masks against the layer. A conductive liquid or paste in one chamber is pumped through each bore from one chamber into the other, via the adjoining perforations, by the respective application of pressure and suction to these chambers with the aid of membranes or pistons moving codirectionally in one or more strokes.
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