| 发明名称 | Method for manufacturing metal encapsulation member | ||
| 摘要 | A method for manufacturing a metal encapsulation member is disclosed. The method comprises: preparing a substrate on one side of which an adhesive material is applied; adhering a metal member onto the one side of the substrate; attaching an adhesive member onto the metal member; and removing predetermined portions of the metal member and the adhesive member. | ||
| 申请公布号 | US9457550(B2) | 申请公布日期 | 2016.10.04 |
| 申请号 | US201414260575 | 申请日期 | 2014.04.24 |
| 申请人 | TGO TECH. CORPORATION | 发明人 | Lee Dong Jin;Lee Yoo Jin;Lee Jae Hak |
| 分类号 | H01L51/56;H01L33/52;B32B38/10;B32B37/18;H01L51/52;H01L33/56;H01L33/54;B32B37/12;B32B38/00;B32B38/18 | 主分类号 | H01L51/56 |
| 代理机构 | Cantor Colburn LLP | 代理人 | Cantor Colburn LLP |
| 主权项 | 1. A method for manufacturing a metal encapsulation member, comprising: preparing a substrate; applying an adhesive material onto a surface of the substrate to form an adhesive material layer on the substrate; adhering a metal member onto the adhesive material layer; attaching an adhesive member onto the metal member; removing predetermined portions of the metal member and the adhesive member, without removing the adhesive material layer, to form exposed portions, exposing the adhesive material; and forming a removable protective member onto the exposed portions and the remaining metal member and adhesive member to enclose and protect the remaining metal member and adhesive member. | ||
| 地址 | KR | ||