发明名称 |
Adhesion characterization test site |
摘要 |
A test site for gauging the adhesion between the insulating layers and the metal layers used to produce the various devices on a semiconductor chip. The chip-sized test site can be formed along with the product chips on the product wafers. The layers of the test site are arranged such that a first polyimide layer forms a first test interface with a silicon nitride layer and a second test interface with a first metal layer, and a second polyimide layer forms a third test interface with a second metal layer, a fourth test interface with the first polyimide layer, and a fifth test interface with the silicon nitride layer. These five interfaces form a single continuous adhesion test interface. During a 90 DEG peel test, the layers of the test site will sequentially separate along this interface. Thus, the adhesion at five different interfaces can be tested during a single peel test on a chip-sized test site.
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申请公布号 |
US4612805(A) |
申请公布日期 |
1986.09.23 |
申请号 |
US19840685867 |
申请日期 |
1984.12.24 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BRUCE, JAMES A.;NARECHANIA, RAJESH G. |
分类号 |
G01R31/26;G01N3/00;G01N19/04;G01N33/38;H01L21/66;H01L23/544;(IPC1-7):G01B21/08;G01N3/08 |
主分类号 |
G01R31/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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