| 摘要 |
A method is provided for plating a non-metal substrate (S), allowing a plated part to be obtained. The method includes steps of: (a) providing a non-metal substrate (S) having a surface (11); (b) forming a bonding layer (C1) on the surface (11); (c) forming at least one reinforcement layer (C2) on the bonding layer (C1); (d) forming a varnish layer (C4) above the reinforcement layer (C2); and performing a drying step to dry the varnish layer, wherein the varnish layer is exposed to ultraviolet radiation. |
