发明名称 BONDING APPARATUS
摘要 The present invention relates to a bonding apparatus having a width adjustable drive unit. According to an embodiment of the present invention, the bonding apparatus comprises: a frame which drives between inner insulation panels among outer insulation panels, secondary main protective walls, and the inner insulation panels which are progressively stacked; a drive unit which is installed to the frame to drive the frame between the inner insulation panels; an adhesive coating unit which is installed to the frame to coat the secondary main protective walls with an adhesive; and a secondary auxiliary wall supply unit which is installed at the frame and supplying secondary auxiliary walls on top of the adhesive, which is coated on the secondary main protective walls. The drive unit comprises a body unit connected to the frame; a pair of driving members which are individually disposed on both sides of the body unit, and drive the inner insulation panels; and connection arms whose both ends are individually connected to the body unit and the driving members to be able to rotate.
申请公布号 KR20160113413(A) 申请公布日期 2016.09.29
申请号 KR20150038395 申请日期 2015.03.19
申请人 SAMSUNG HEAVY IND. CO., LTD. 发明人 LEE, IN HO;KIM, SEONG TAE;CHO, HYUN GI
分类号 B63B25/16;B65D90/06;F17C1/12;F17C13/00 主分类号 B63B25/16
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