发明名称 MANUFACTURE OF CONDUCTIVE CIRCUIT PATTERN
摘要 PURPOSE:To obtain an inexpensive conductive circuit pattern with superior productivity by printing desired conductive circuits on both surfaces of an insulating film, forming adhesive layers on the conductive circuits on both surfaces, and providing a protection member on one adhesive layer and also sticking the other on a base body. CONSTITUTION:Conductive circuits 2 are formed on both surfaces of the insulating film 3 by screen printing, offset printing, etc., using conductive ink. Then the adhesive layers 4 are formed on the conductive circuits. One adhesive layer 4 adhered to the base 1 and the protection member 5 is stuck on the other side. Consequently, a conductive circuit pattern is manufactured by an easy method at low cost with high accuracy and applied to various article detection systems.
申请公布号 JPS63276191(A) 申请公布日期 1988.11.14
申请号 JP19870109784 申请日期 1987.05.07
申请人 RICOH CO LTD 发明人 ONUMA TERUYUKI;MOCHIZUKI NOBUO;KUBO TAKASHI
分类号 G08B13/24;G06K19/07;G06K19/077;H01B13/00;H05K1/09;H05K1/16;H05K3/28 主分类号 G08B13/24
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