发明名称 DUMET WIRE
摘要 PURPOSE:To secure the high sealing reliability and reduce the cost by providing a copper-plated layer on an Fe-Ni alloy core wire and pressing a copper or copper alloy covering layer to secure the necessary conductivity on it. CONSTITUTION:A copper-plated layer 2 with the weight ratio of 0.5-10% against the whole 100 is provided on an Fe-Ni alloy core wire 1, and a copper or copper alloy covering layer 3 is pressed to the copper-plated layer on this core material to form a Dumet wire 4. Since the layer 2 made of copper is a plated layer, it satisfactorily adheres to the Fe-Ni alloy core wire 1 which is a different kind of metal, and no gap is generated on the interface with the core wire 1. On the other hand, the copper or copper alloy covering layer 3 is pressure-welded, but the interface with the lower copper-plated layer is pressure-welded between different kinds of metals, and the adhesion more excellent than that obtained by the direct pressure welding on the Fe-Ni alloy core wire 1 can be obtained. The gas leak through interfaces between the core wire 1 and the layer 2 and between the layers 2, 3 thereby rarely occurs, and the hermetic sealing reliability is improved.
申请公布号 JPS63284716(A) 申请公布日期 1988.11.22
申请号 JP19870119272 申请日期 1987.05.15
申请人 SUMITOMO ELECTRIC IND LTD 发明人 SUGAI TAKESHI;KUDO KAZUNAO
分类号 H01K1/40;H01B5/02;H01L23/48;H01L23/50 主分类号 H01K1/40
代理机构 代理人
主权项
地址