发明名称 |
Polyamide resin composition |
摘要 |
Disclosed herein is a polyamide resin composition comprising a polyamide resin, from 0.1 to 1% by weight of fine silica based on the polyamide resin and from 1 to 99% by weight of a silane coupling agent based on the fine silica. The packaging material obtained from the polyamide resin composition of the present invention has uniform and satisfactory transparency and is excellent in the blocking resistance.
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申请公布号 |
US4804720(A) |
申请公布日期 |
1989.02.14 |
申请号 |
US19880178224 |
申请日期 |
1988.04.06 |
申请人 |
MITSUBISHI CHEMICAL INDUSTRIES LIMITED |
发明人 |
TAMURA, MITSUHIKO;MIYAMOTO, MASAAKI;UEDA, MASAYA;KAMOSHIDA, EIICHI |
分类号 |
C08K3/36;C08K5/54;C08K9/06;C08L77/00;(IPC1-7):C08L77/00;C08K9/04 |
主分类号 |
C08K3/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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