发明名称 Graphite sheet to protect SMT components from thermal exposure
摘要 A formed graphite sheet is shaped and sized as a protective shield positioned over an electronic component coupled to a PCB. The formed graphite sheet is used to protect a body of the electronic component from heat applied during the assembly of the electronic component to the PCB, such as the heating steps used in SMT and through-hole technology.
申请公布号 US9521738(B1) 申请公布日期 2016.12.13
申请号 US201414560898 申请日期 2014.12.04
申请人 Flextronics AP, LLC 发明人 Willie Dennis;Loi Richard;Geiger David;Mohammed Anwar;Kurwa Murad;Hernandez Hector Rene Marin
分类号 H05K7/20;H05K1/02;H01L23/473 主分类号 H05K7/20
代理机构 Haverstock & Owens LLP 代理人 Haverstock & Owens LLP
主权项 1. A heat shielding system comprising: a. a substrate having a first surface; b. an electronic component having a body and one or more electronic leads extending from the body, wherein the electronic component is coupled to the substrate; and c. a formed graphite sheet positioned over the electronic component and coupled to the first surface of the substrate, wherein the formed graphite sheet is configured to enable a temperature gradient between the body of the electronic component and the one or more electronic leads when external heat is applied to the system, wherein the temperature gradient is enabled such that an electronic lead temperature is at least a first threshold temperature while a body temperature is maintained below a second threshold temperature where the second threshold temperature is less than the first threshold temperature.
地址 Broomfield CO US