| 摘要 |
The hermetic package (10) has an interior recess (46) for receipt of a semiconductor chip. The recess is square and set at 45 DEG with respect to the rectangular exterior of the package. The ceramic layers which make up the package carry conductive planes thereof with the interior opening stepped to provide connection points. The lowest layer having a chip opening therein may be left out of the assembly to provide a shallower chip opening recess. |
