发明名称 Autocatalytic electroless gold plating composition
摘要 An aqueous autocatalytic electroless gold plating composition having improved stability and an excellent plating rate is provided which comprises about 0.002 to about 005M of a water-soluble alkali metal monovalent gold cyanide complex, about 0.01 to about 0.1M of a water-soluble cyanide compound, about 0.1 to about 1.0M of a carbonte compound, and about 0.01 to about 0.1M of a reducing agent selected from the group consisting of water soluble alkali metal borohydrides and water soluble amine boranes, the plating composition having a plating rate within the range of about 10 to about 14.
申请公布号 US4978559(A) 申请公布日期 1990.12.18
申请号 US19890431360 申请日期 1989.11.03
申请人 GENERAL ELECTRIC COMPANY 发明人 IACOVANGELO, CHARLES D.
分类号 C23C18/44 主分类号 C23C18/44
代理机构 代理人
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