发明名称 EPOXY RESIN BLENDS AND CURABLE COMPOSITIONS CONTAINING SAME
摘要 Blends comprising (A) at least one unsaturated hydrocarbon-phenol epoxy resin having an average of more than two vicinal epoxy groups per molecule; (B) at least one compound having an average of more than two vicinal epoxy groups per molecule and which is different from component (A); (C) optionally, at least one compound having an average of more than one, but not more than two vicinal epoxy groups per molecule and, (D) at least one rubber or elastomer; and wherein component (C) is present in an amount such that from zero to less than 20 percent of the total amount of vicinal epoxy groups contained in components (A), (B) and (C) is contributed by component (C) are useful in formulations for encapsulating electrical components. 37,657-F
申请公布号 CA2027924(A1) 申请公布日期 1991.04.20
申请号 CA19902027924 申请日期 1990.10.18
申请人 DOW CHEMICAL COMPANY (THE) 发明人 KLEWENO, DOUGLAS G.;WANG, CHUN S.;HOFFMAN, DWIGHT K.
分类号 C08G59/00;C08G59/20;C08L21/00;C08L63/00;H01L23/29;H01L23/31;(IPC1-7):C08L63/00;C08L57/00;H05K5/02;H01L21/56 主分类号 C08G59/00
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