| 摘要 |
New standard industrial grade solder is first applied to leads of a tape automated bonding (TAB) component of a printed circuit board (PCB) to be replaced, which was previously bonded using standard industrial grade solder. The new and old solder are melted at the same time. The TAB component is removed without removing all the melted new solder. After applying flux to the solder pads, a replacement TAB component is placed onto the TAB component site. Heat and pressure are applied to leads of the replacement TAB component at the same time while the replacement TAB component is being placed onto the TAB component site. Pressure is maintained until the leads and the remaining new solder have cooled below the solder's melting temperature. As a result, the replacement TAB component is connected to the PCB replacing the removed TAB component with reduced number of steps and cycle time for the steps, thereby reducing opportunities to damage the PCB.
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