| 摘要 |
PURPOSE:To possible a good heat dissipation design and to contrive a reduction in the heat resistances of semiconductor chips of a face up mounting system by a method wherein heat sinks are individually installed on the chips mounted in a face up manner. CONSTITUTION:Holes 7a are bored at positions, which correspond to the mounting positions of face down type semiconductor chips 4a, on a cap 2. Holes 7 of a diameter larger than that of the holes 7a are bored at positions, which correspond to the mounting positions of face up type semiconductor chips 4, on the cap 2. Each one end part of heat sinks 3 and 3a is inserted in the bored holes 7 and 7a. Bonding wires 8 are covered with an insulating material consisting of urethane or the like. Accordingly, heat generated from the chips 4 is diverged outside of the cap 2 via the sinks 3. Moreover, even if the sinks 3 are constituted of a conductive material, the electrical characteristics of the chips are never deteriorated by the contact of the sinks 3 with the wires 8. Thereby, an increase in the size of the heat sinks becomes possible. |
