发明名称 |
ELECTRIC CONNECTING CONSTRUCTION BETWEEN CIRCUIT BOARD AND COMPONENT TO BE LOADED THEREON AND ELECTROMAGNETIC SHIELD CONSTRUCTION USING SAME TOGETHER WITH ELECTRONIC CIRCUIT MODULE PROVIDED WITH ELECTROMAGNETIC SHIELD |
摘要 |
PURPOSE:To offer an electrically connecting structure able to connect and load electronic components to a substrate while improving certainty of mutual electric continuity by more simple operation. CONSTITUTION:A hole 8 is provided by making a substrate on a wiring pattern 2 formed on a circuit board 1 so as to go through the board 1 while providing a resin-made projection 10 convered by a conductor film 11 on the lower part of the components to be loaded on the circuit board 1 and tightly fitting the resin-made projection 10 into the hole 8 on the circuit board. |
申请公布号 |
JPH0590428(A) |
申请公布日期 |
1993.04.09 |
申请号 |
JP19910252064 |
申请日期 |
1991.09.30 |
申请人 |
ROHM CO LTD |
发明人 |
KOBAYASHI TAKASHI;TAKAYAMA NOBORU |
分类号 |
H01L23/00 |
主分类号 |
H01L23/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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