发明名称 ELECTRIC CONNECTING CONSTRUCTION BETWEEN CIRCUIT BOARD AND COMPONENT TO BE LOADED THEREON AND ELECTROMAGNETIC SHIELD CONSTRUCTION USING SAME TOGETHER WITH ELECTRONIC CIRCUIT MODULE PROVIDED WITH ELECTROMAGNETIC SHIELD
摘要 PURPOSE:To offer an electrically connecting structure able to connect and load electronic components to a substrate while improving certainty of mutual electric continuity by more simple operation. CONSTITUTION:A hole 8 is provided by making a substrate on a wiring pattern 2 formed on a circuit board 1 so as to go through the board 1 while providing a resin-made projection 10 convered by a conductor film 11 on the lower part of the components to be loaded on the circuit board 1 and tightly fitting the resin-made projection 10 into the hole 8 on the circuit board.
申请公布号 JPH0590428(A) 申请公布日期 1993.04.09
申请号 JP19910252064 申请日期 1991.09.30
申请人 ROHM CO LTD 发明人 KOBAYASHI TAKASHI;TAKAYAMA NOBORU
分类号 H01L23/00 主分类号 H01L23/00
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