| 摘要 |
PURPOSE:To provide a method for preventing adverse influence due to adherence of broken pieces of an alignment mark to a chip region when the wafer is scribed in a chip pattern in a process of the mark (normally formed on a scribing line) in the case of manufacturing a semiconductor device. CONSTITUTION:Before a wafer is scribed in a chip pattern after manufacturing steps of a semiconductor wafer are finished, the marks 3a, 3b are removed by photolithography and etching. |
