| 摘要 |
<p>PURPOSE:To prevent generation of package cracks. CONSTITUTION:A lead frame 3A constituted of a die pad 4 and inner leads 5 and outer leads 6 which are formed in the peripheral part of the die pad 4. A thin stripe protrusion 20 is formed between the inner leads 5. The protrusion 20 is so exposed that the same surface as the side surface of a package 11 formed by sealing resin 10 is constituted, and forms a vapor pressure reducing means. Since the die pad is exposed to the outer space via the thin stripe protrusion, the pressure of water vapor which is generated by heating water content existing in the vicinity of the die pad when a resin-molded semiconductor device is packaged can be reduced. Hence generation of package crack due to vapor pressure can be prevented.</p> |
