发明名称 チップインダクタ
摘要 PROBLEM TO BE SOLVED: To maintain the operation of circuit components and electronic components satisfactorily by reducing leakage flux of a chip inductor for surface mounting on a wiring board or for built in a wiring board, thereby reducing the impact of noise due to leakage flux on other circuit components and electronic components mounted on a wiring board.SOLUTION: The chip inductor for surface mounting on a wiring board or for built in a wiring board comprises: an internal conductor that makes up a coil 12 embedded in a magnetic material layer 11; a pair of electrodes 13 disposed at positions intersecting a surface of the magnetic material layer including the internal conductor, and connected electrically with one and the other ends of the internal conductor; and an electromagnetic wave noise absorption layer 14 placed on a surface of the magnetic material layer parallel with the surface including the internal conductor.
申请公布号 JP6029814(B2) 申请公布日期 2016.11.24
申请号 JP20110181788 申请日期 2011.08.23
申请人 大日本印刷株式会社 发明人 島田 修
分类号 H01F27/00;H01F1/00;H01F17/00;H01F27/02 主分类号 H01F27/00
代理机构 代理人
主权项
地址