| 摘要 |
<p>A substrate for mounting semiconductor adapted to high-density packaging. In order to highly densely mount the multi-terminal electronic parts, the substrate is made up of a lead frame as a base which consists of die pads and leads and wherein an adhesive layer and an insulator layer are formed on the lead frame, while conductor circuits are formed thereon by the additive method, and the conductor circuits and the leads are connected together through plated conductors. With the device thus constituted, no printed wiring board is required since an IC can be directly mounted on the lead frame via the plated conductor circuit.</p> |
