| 摘要 |
PURPOSE:To provide the subject composition containing an epoxy resin, a novolak type phenolic resin, a specific mold release agent and an inorganic filler in a specific ratio, not staining molds, excellent moldability, moisture resistance, mold release property and gate-breaking property, and useful for sealing semiconductors, etc. CONSTITUTION:The objective composition comprises (A) an epoxy resin, (B) a novolak phenolic resin, (C) 0.05-1.0wt.% (based on the resin composition) of a mold release agent of the formula (R is 20-35C alkyl), and (D) 25-90wt.% of an inorganic filler such as silica powder. A semiconductor chip is sealed with the cured product of the composition to provide a sealed semiconductor device. The components A and B are preferably compounded in a molar ratio of 1:(0.1-100 between the epoxy groups of the component A and the phenolic hydroxyl groups of the component B. |
