| 摘要 |
PURPOSE:To provide a highly integrated resin sealed semiconductor device having many built-in semiconductor chips. CONSTITUTION:Bumps 4 are used to connect a semiconductor chip 2 to both sides of films 3, on which wiring is applied, and the bumps 4 are also used to connect leads 5 to both sides of films 3, on which wiring is applied. This allows one resin sealed semiconductor device to contain many semiconductor chips. |
