| 摘要 |
PURPOSE:To provide a method for connecting a semiconductor element having high yield and high reliability. CONSTITUTION:The method for connecting a semiconductor element comprises the steps of uniformly spreading a plurality of conductive particles 17 on a plane jig, pressing the element 11 provided with metal bumps 9 parallel to the jig on connecting electrodes 5 to adhere the particles 17 to the bumps 9, press-bonding the bumps 9 of the element 11 to connecting pads 3 of a circuit board 4 through the particles 17 to electrically connect the bumps 9 to the pads 3, and inserting an insulation adhesive sheet 13 to a gap between the element 11 and the board 4 to fix the element 11 to the board 4. |
