| 摘要 |
PURPOSE:To reduce GND noise for a semiconductor device and, at the same time, to make GND-level wiring easier. CONSTITUTION:GND pads 11 are provided for every output transistor 5 and, at the same time, a loop-like GND lead 12a is arranged around an IC chip 4 so that the lead 12a can intersect leads 3b at insulating distances in the thickness direction. In addition, the pads 11 are connected to the lead 12a through metallic thin wires 7.
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