| 摘要 |
PURPOSE:To enhance the mounting efficiency of an element onto a wiring board while the conductivity of Joule heat generated from an IC chip is being kept. CONSTITUTION:In order to obtain the heat-dissipating effect of an enclosure 10 for an IC package, shapes at tip parts of external terminals 12a, for heat- dissipating use, which are formed by extending a chip stand 12, on which an IC chip 11 is mounted, to the outside of the enclosure 10 for the IC package are made equal to shapes at tip parts of other external terminals 13a. Thereby, the IC package is formed so as to perform the mounting operation of the title element onto a wiring board in the same manner as an IC package in conventional cases.
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