| 摘要 |
PURPOSE:To reduce the strain of a semiconductor device due to the shrinkage stress of an adhesive and to improve the reliability of an electrical connection in packaging. CONSTITUTION:A metal bump 2 is formed on a semiconductor device 1, a conductive terminal 4 is formed on a substrate 3 which packages the semiconductor device 1, and, when the bump 2 is connected to the terminal 4, the periphery of a connection is buried. An adhesive 5-1 sufficient to fill a gap between the semiconductor device 1 and the packaging substrate 3 is applied to the semiconductor device 1 or the substrate 3. In a condition of the bump 2 pressed to the terminal 4, the adhesive 5-1 is hardened. Further, as a bump 2-1 to replace the bump 2, a groove 12 is formed on the surface, or as a bump 2-5 a recessed part 18-1 which retains the surface contour is formed and used. |
