SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

摘要

The present invention relates to a semiconductor package and a manufacturing method thereof, and more specifically, to a semiconductor package and a manufacturing method thereof, to manufacture a semiconductor package of a structure having a hybrid type redistribution layer capable of realizing size reduction and manufacturing cost reduction in comparison with a package using an existing interposer. In other words, a first redistribution layer for an interposer conductively connected to a bonding pad is formed on one surface of a semiconductor chip and a second redistribution layer for signal input/output is formed in the first redistribution layer for an interposer, so electrical input/output through each redistribution layer can be easily realized and the entire package size can be reduced even if a gap between the bonding pads of a semiconductor chip is an ultrafine pitch.