| 摘要 |
PURPOSE: To improve humidity resistance by adding ceramic coating on a plastic packaged semiconductor device, excepting the parts of lead wires. CONSTITUTION: On plastic material 11 of a plastic packaged semiconductor device 10, ceramic coating 12 having humidity resistance like alumina is added, excepting external connection parts of lead wires 13, 14, through a mask with plasma spray, by using a plasma torch having a powder feeder. On a small part of the lead wire adjacent to the plastic material 11, a stretching part 16 of the ceramic coating is formed, thereby reducing the moisture permeating the inside of a capsule along the lead wires 13, 14. The ceramic coating 12 is closely in contact with the plastic material 11, so that heat conduction characteristics of the package are improved. |
