| 摘要 |
PURPOSE:To provide a wiring board admitting a high density wire laying and excellent in the heat resistance by applying an adhesive layer, whose softening point in the B stage lies in a specific temp. range and which includes a hardened substance having a softening point over a specific level, on the surface of an insulation layer of an insulated electric wire. CONSTITUTION:On the surface of an insulation layer of an insulated electric wire consisting of core and insulative layer, an adhesive layer is applied whose softening point in the B stage ranges 35-85 deg.C and which includes a hardened substance having a softening point over 110 deg.C. When wire laying takes place in the condition that the softening point in B stage is higher than 85 deg.C, poor wiring performance is generated due to exfoliation, and if lower than 35 deg.C, wires wound on a bobbin, etc., attached to one another so that it can not serve any more. If the softening point of the hardened substance in this adhesive layer is over 110 deg.C, the heat resistance when moisture in multi-wire wiring board is absorbed, is enhanced. |
