METHOD FOR THE MANUFACTURE OF WAFERBOARD

摘要

METHOD FOR THE MANUFACTURE OF WAFERBOARD A method for applying release agent to wood material and binder used in the manufacture of chipboard. An aqueous solution of the release agent is foamed to form a coherent foam blanket that is applied to the wood material and binder. The foam leaves a coating of release agent on the wood material and binder that enhances release of a platen from the same. Foaming the release agent avoids deleterious aerosolization and increases the efficiency of applying the release agent.