发明名称 WAFER FIXING MOUNT FOR POLISHING DEVICE
摘要 PURPOSE:To make it possible to eliminate the need for wax, and what is more, to fix a wafer with highly accurate parallelism thus maintained and charge many wafers at one time. CONSTITUTION:A wafer fixing groove is formed on a ceramic-made mount body 12. The inside diameter of the wafer fixing groove 14 thus formed is 0.1 to 4.0mm larger than the diameter of a wafer which is a workpiece. The depth of the wafer fixing groove 14 is set so that it may be slightly shallower than the finished thickness of the wafer. The wafer is fixed by spreading pure water on the inner bottom of the wafer fixing groove 14 and producing the surface tension of the pure water.
申请公布号 JPH0758067(A) 申请公布日期 1995.03.03
申请号 JP19930225091 申请日期 1993.08.18
申请人 TOSHIBA CERAMICS CO LTD 发明人 NISHIMOTO YASUSHI;MATSUOKA YASUO
分类号 B23Q3/08;B24B29/00;H01L21/304;(IPC1-7):H01L21/304 主分类号 B23Q3/08
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