| 摘要 |
PURPOSE:To simplify the structure, to reduce the amount of material, and to eliminate a secondary processing by using an adhesive layer as a cover lay film lay for a flexible interconnection section. CONSTITUTION:An adhesive film layer 7 which exists for bonding a flexible interconnection layer 6 and a rigid interconnection layer to the flexible interconnection layer 6 into one body is extended and formed on the surface of the flexible interconnection layer 6 which is extended from an end face of a three- layer printed wiring section 5 and which constitutes a bendable section. The insulating adhesive sheet 7 and a rigid printed wiring board 5 are positioned on the surface of the flexible wiring section 6 and then are stacked into a laminate. After that, the laminate is heated and pressurized at 70-180 deg.C, 25-35kg/cm to obtain a rigid, flexible printed wiring board. By this method, a relatively low-cost and very reliable rigid, flexible printed wiring board can be obtained. |
