Testing instrument for integrated semiconductor circuits

摘要

A testing instrument according to the invention contains an upper mounting plate for applying a multiplicity of integrated circuit units onto the upper surface of the upper mounting plate and having a multiplicity of pins which extend from the lower surface of the upper mounting plate, and a lower mounting plate for combination with the upper mounting plate by means of the pins, fitted into a multiplicity of grooves formed respectively in a multiplicity of supports which fit into the lower mounting plate, in which the pins are connected via connecting circuit conductors formed in the upper mounting plate to outer supply lines of the integrated circuit unit, and have greater separations in the lower position than in the upper position.