摘要 |
A heat sink (10, 50) in particular for connection to a semiconductor housing (1, 6) is proposed, in which two opposite sides (52, 53) can be connected in clip-fashion (53, 54, 55) to a housing (1, 6) and an elastic region (53, 54, 55) is arranged in at least one of the sides. In particular, an elastic connection (13) between two cooling fins works in conjunction with a web-shaped form (14, 15, 16; 54, 55,) of the heat sink, for which a cooling fin (11a) of the heat sink serves as a lever arm, as an elastic fastening integrated in the heat sink. As an alternative, the elastic region can be designed as a snap-fastening connection. Advantages of the invention are simple and cost-effective yet secure fastening of the heat sink to the housing. <IMAGE> |
申请人 |
SIEMENS AG, 80333 MUENCHEN, DE |
发明人 |
PAPE, HEINZ, DIPL.-PHYS., 81541 MUENCHEN, DE;LUCKNER, UWE, DIPL.-ING. (FH), 81541 MUENCHEN, DE |