| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic device which includes an electronic component sealed with mold resin and an electronic component disposed outside the mold resin and enables a substrate to be downsized.SOLUTION: A second electronic component 50 is disposed on mold resin 40. The structure enables a substrate 10 to be downsized, compared to an electronic device where the second electronic component 50 is disposed in a portion of one surface 11 of the substrate 10 which is not sealed with the mold resin 40.SELECTED DRAWING: Figure 2 |
