| 摘要 |
A method for producing a circuit board having a multiplicity of conductive vias, a generally planar diamond substrate is provided (110). A multiplicity of via holes are formed through the substrate (120). The holes are loaded with a conductive reactive braze material (130). The braze material and the substrate are heated to a temperature which causes the braze material to melt and to react with the inner surface of the via holes and bond thereto (140). The circuit board formed comprises conductive vias which pass through the diamond substrate and form a compound with the substrate at the inner surface of the via holes to bond to said inner surface of the via holes. <IMAGE> |
