| 摘要 |
PURPOSE:To improve quality and achieve a high-density packaging while conserving earth environment without breaking ozone layer by printing a thick-film dielectric paste on a circuit substrate and then applying ultraviolet rays via a glass mask negative and performing development with a specific development agent. CONSTITUTION:A thick-film dielectric paste 4 containing a sensitized resin is printed on a circuit substrate 1 by a screen 3 for thick-film printing where the pattern of a large-diameter via hole 7 is formed by emulsion 2. Then, ultraviolet rays are applied via a glass mask negative 5 where the patterns of the large-diameter via hole 7 and a small-diameter via hole 6 are formed. Then, the mixed liquid of acetic ether or ester solvent medium as a development solvent medium and normal hexane or xylene or benzene as a development suppression solvent medium is used as a development agent for development. Further, the circuit substrate 1 is mounted on a spinner as the development system and is developed by the shower or puddle system, thus achieving a high-density packaging without breaking ozone layer on earth. |
