| 摘要 |
PURPOSE:To absorb the scattering in the height of a semiconductor chip and to make uniform and reduce the thickness with a die and sealing solder thickness by forming at least either one of a carrier substrate or a cap including rubber. CONSTITUTION:The module is provided with a carrier substrate 10 where a frame 4 for mounting a cap 9 is mounted to the side surface of a wiring substrate 2 with rubber 3 and the multiple surfaces of an IC chip 1 are mounted by a diemounting solder 8 and the edge part of a frame 4 is mounted by a sealing solder 7. By unifying the materials of the wiring substrate 2, the frame 4, and the cap 9 with alumina and AlN, a problem due to the difference in a thermal coefficient of expansion can be prevented. Silicone rubber is used for the rubber 3. The silicone rubber has improved heat resistance, fire-retardant property, radioactive ray resistance, and electrical characteristics and heat generated by the IC chip 1 is transferred to the cap 9 and escapes from the chip. Therefore, by making thin the thickness of the solder 8 with die, the thermal resistance of the carrier can be reduced. |
