发明名称 RESIN COMPOSITION AND RESIN COMPOSITION FOR PREPREG
摘要 PURPOSE: To obtain a resin composition which has excellent properties for prepregs and can give a laminate by mixing a normally solid epoxy resin with an epoxy resin curing agent, a specified diluent and a photopolymerization initiator. CONSTITUTION: This composition comprises a normally solid epoxy resin (desirably of a molecular weight of 500 or above), an epoxy resin curing agent, a diluent comprising a photopolymerizable and heat-polymerizable monomer [e.g. desirably one comprising a photopolymerizable and heat-polymerizable monomer having at least one (meth)acryloyl group and at least one glycidyl group in the molecule] and a photopolymerization initiator. This composition can be infiltrated into a fibrous material without leaving any bubbles in the material, the impregnated material can be converted into a prepreg simply by irradiation with an actinic radiation, and the obtained prepreg can be made tack-free without any thermal curing reaction. Therefore, this prepreg is flexible, does not form rein dust, is capable of being wound around e.g. a roll and is very clean.
申请公布号 JPH0873565(A) 申请公布日期 1996.03.19
申请号 JP19940213001 申请日期 1994.09.06
申请人 SUMITOMO BAKELITE CO LTD 发明人 HOZUMI TAKESHI;NAKAMICHI SEI
分类号 C08J5/24;C08G59/20;C08G59/40;(IPC1-7):C08G59/40 主分类号 C08J5/24
代理机构 代理人
主权项
地址