CERAMIC PRINTED WIRING BOARD AND ITS MANUFACTURE

摘要

PURPOSE: To provide a ceramic printed wiring board and a method of manufacturing the same which can prevent the fall of capability for close contactness of a conductive circuit due to diffusion of the tin element of solder without deteriorating die-bonding and wire-bonding capability. CONSTITUTION: In a ceramic printed wiring board 5 where a conductive circuit portion is formed on a ceramic substrate 1 with inclusion of an under layer 2 of copper layer 2c, an intermediate layer 3 of paradium layer 3p and a surface layer 4 of a gold layer 4a, a metal layer 6 including cobalt or nickel is formed in the area between the ceramic substrate 1 and copper layer 2c in the part where parts are soldered with a solder 7. Thickness of metal layer 6 is 0.3 to 1.5μm. A metal layer 6 is formed by coating the ceramic substrate 1 with a paste including cobalt or nickel and then baking the surface at 600 to 950 deg.C under the nitrogen atmosphere.