Chip mode isolation and cross-talk reduction through buried metal layers and through-vias

摘要

A method for fabricating a chip surface base includes preparing a first substrate, preparing a plurality of vias in the first substrate, depositing metal fillings into the plurality of vias, preparing a second substrate, bonding the first and second substrates and exposing the metal fillings. A method for fabricating a chip surface base includes preparing a first and second substrate, depositing a metal on at least one of the first and second substrates, bonding the first and second substrates, preparing a plurality of vias in the first substrate, depositing metal fillings into the plurality of vias and exposing the metal fillings. A chip surface base device includes a first substrate, a second substrate, a metal layer disposed between the first and second substrates and a plurality vias disposed on the first substrate.

主权项

1. A method for fabricating a chip surface base, the method comprising:
preparing a first substrate; forming a plurality of vias in a top surface of the first substrate; depositing metal fillings into the plurality of vias; forming a first metal layer on the top surface of the first substrate and in contact with the plurality of vias; preparing a second substrate; forming a second metal layer on a top surface of the second substrate; bonding the first and second substrates at the first and second metal layers so as to form a bonded, buried metal layer; polishing a bottom surface of the first substrate so as to expose the metal fillings, wherein the resultant structure comprises the first substrate contacting the first metal layer, the second substrate contacting the second metal layer and the first metal layer contacting the second metal layer; and etching the first and second substrates to fabricate a qubit circuit; fabricating a qubit circuit, wherein the qubit circuit is on the first substrate and is coupled to a plurality of chip modes, the plurality of chip modes operative to conduct into the metal fillings deposited into the plurality of vias and define a short into the metal layer between the second substrate and the first substrate, wherein the plurality of chip modes have wavelengths longer than distances between vias in the plurality of vias; and wherein the plurality of vias is arranged in a location on the first substrate such that the plurality of vias isolates the plurality of chip modes between the plurality of vias and the metal layer between the second substrate and the first substrate.