发明名称 SPUTTERING DEVICE
摘要 <p>PURPOSE: To prevent wafer transfer abnormalities due to Al film coalescence by providing a means that presses a subject to be processed to a holder before releasing the subject from a clamp ring. CONSTITUTION: When sputtering is completed, introduction/relief valves 19 and 26 are closed, an exhaust valve 28 is opened and the pressure of an adjustment chamber 17 is set at a first prescribed value. A main valve 12 is closed simultaneously with the opening of the exhaust valve 28, and the pressure in a sputtering room 10 is set at a second prescribed value. Since different pressure is applied on the front and rear planes of the wafer 2, the wafer 2 is held on a holder 4 by the pressure difference. Then, a clamp ring is permitted to ascend. Even when the clamp ring coalesces with the wafer 2 by the Al film, since the wafer 2 is pressed to the holder 4 by the pressure difference, the coalescence part of the Al film is torn by the ascending of the clamp ring. Then, the exhaust valve 28 is closed, the relief valve 26 is opened, and the pressure in the sputtering room 10 and the pressure in the adjusting chamber 17 are permitted to be at the same value. Then, a plunging up pin 3 is permitted to ascend, and the wafer 2 is brought up.</p>
申请公布号 JPH08186074(A) 申请公布日期 1996.07.16
申请号 JP19940326564 申请日期 1994.12.28
申请人 HITACHI LTD 发明人 MITSUI KATSUHIRO
分类号 C23C14/34;C23C14/50;H01L21/203;H01L21/68;H01L21/683;(IPC1-7):H01L21/203 主分类号 C23C14/34
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