| 摘要 |
PURPOSE: To prevent the position deviation of a sealing material set onto a first film when manufacturing a semiconductor package using a pair of films. CONSTITUTION: A semiconductor device 13 and a sealing material 11 are set onto a mold 2 via a first film 21, a second film 22 covers them, the mold 1 is closed, and then the sealing material 11 between both films 21 and 22 is pressurized and heated to inject the sealing material 11 into a cavity, thus sealing a semiconductor device 13. A suction hole (sucking means) 5a is provided in advance at a plunger 5 provided at a pot part 4 of the mold 2 and the first film 21 on the pot part 4 is sucked onto the surface of the port part externally via the suction hole 5a when setting the sealing material 11 onto the mold 2 via the first film 21 and the sealing material 11 is set onto the same pot part 4 in that state. |
