IC PACKAGE POSITIONING METHOD OF CHARACTERISTICS CLASSIFICATION EQUIPMENT, AND ITS STRUCTURE

摘要

PURPOSE: To provide accurate and stable positioning structure of an IC package of a characteristics classification equipment. CONSTITUTION: IC package positioning structure of a characteristics classification equipment mounts an IC package and brings an IC lead into contact connection with a socket terminal 16a. The structure is provided with a positioning block 10, a spring 17, and a terminal presser foot 15 having plunger mechanism. The positioning block 10 is arranged above an IC socket part, and has taper guides 13, 14 formed on both ends in the X direction of the IC package mounting position and a plurality of square guide pins 11, 12 formed on both ends in the Y direction. The spring 17 engages freely the positioning block 10, in the vertical direction, with the IC socket part. The plunger mechanism brings the IC lead into contact with the IC socket terminal while pressing the IC package, after the IC package is mounted on the positioning block 10.